Intel thinks glass substrates are a clear winner in multi-die packaging
Intel thinks glass substrates are a clear winner in multi-die packaging 19/09/2023 at 01:02 By Tobias Mann Don’t get too excited, tech won’t be ready until the end of the decade Intel’s latest gambit to keep Moores’ Law on life support involves ditching organic substrates — the intermediary through which data and power flows on […]
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